The automotive industry is well known for demanding the highest levels of quality possible. At DK Thermal we have years of experience of working closely with automotive customers, from the initial APQP procedures right through to full PPAP approvals and volume manufacture.

The requirement for thermally efficient systems in LED lighting has been ever present for years now. At DK Thermal we have vast experience in supplying this industry with both PCBs and Thermal Interface Material – leading to a total thermal solution.

The more power supplied to components – the hotter they get, and the less efficient they become. This makes the requirement for heat removal particularly important when looking at high power applications. DK Thermal has the solution.

The advantage of using metal clad material for PCB production as opposed to more traditional materials such as FR4 and CEM is down to the efficient removal of heat. The dielectric insulating material in metal clad materials is designed to have a much superior thermal conductivity than that of FR4, Most materials have a conductivity ranging from 1W/m-K to 9W/m-K, allowing for efficient heat removal.

The requirement to drive electronic components harder and faster, at higher power, from smaller packages means they are running hotter – and too much heat is a component killer. In the battle to get heat away from electronic components, Thermal Interface Material is a simple but very effective, low cost solution that significantly improves the transfer of heat from component to heat sink.

LED’s, Electric vehicle motor drives, audio systems, automotive lighting, braking and steering systems… these are all examples of applications where TIM is used as part of effective thermal management to ensure reliability, performance and to prevent component failure.

Ceramic PCBs have received enormous attention from the industry as an effective solution to a range of electronic issues. The superior Thermal Conductivity of ceramics being the leading reason that more and more industries are turning to ceramics for their PCB design

Heat dissipation is the key advantage that Ceramic has over more conventional materials such as FR4 and Metal Clad PCBs. With components being placed directly on the boards, and no isolation layer, the flow of heat through the boards is far more efficient.

In addition to this, Ceramic material can withstand high operating temperatures (up to 350°C) and has a very low CTE (Coefficient of Thermal Expansion), allowing for additional compatibility options for circuit design.

DK Thermal specialises in Alumina Oxide (Al2O3) and Aluminium Nitride (AlN) using direct bonded copper (DBC) and direct plated copper (DPC) technologies.

DK Thermal are delighted to announce the launch of their new range of Thermal Interface Materials, and EMI/RFI Shielding products. Available under our brand name:

The EMI Thermal range of EMI/EMC/RFI shielding products in conjunction with thermal interface materials (TIM) have been developed to meet the most demanding shielding and thermal requirements. Wherever you are in Europe we can provide the full range of EMI Thermal products. Our highly capable and knowledgeable European distributors will be only too pleased to assist with enquiries. EMI materials can be supplied in sheets, mesh and extrusions, thermal interface material in sheets or rolls

Leave your phone number and one of our specilists will be in touch as soon as possible.

Hertford Town Mill
49 Tamworth Road
Hertford – Herts
SG13 7DJ – United Kingdom

• +44(0) 1992 514200
• sales@dkthermal.co.uk